| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor testing device and a semiconductor testing method, which can inhibit cracks and breakage of an object-to-be-measured when measuring electrical characteristics by contacting probes with the object to be measured from both surfaces of the object to be measured. SOLUTION: A semiconductor testing device comprises: an object-to-be-measured support medium 2 for unfixedly holding a part of a rear face 1b of an object-to-be-measured 1; a plurality of back face probes 3 for measuring electric characteristics by electrical contact with rear face electrodes 1c of the object-to-be-measured 1; and surface probes 4 for measuring electric characteristics by electrical contact with surface electrodes 1d of the object-to-be-measured 1. In the semiconductor testing device, after the plurality of rear face probes 3 contact the back electrodes 1c of the object-to-be-measured 1 unfixedly held by the object-to-be-measured support medium 2, the surface probes 4 contact the surface electrodes 1d located on a surface 1a side in a region R enclosed by the plurality of rear face probes 3. COPYRIGHT: (C)2013,JPO&INPIT |
