发明名称
摘要 PROBLEM TO BE SOLVED: To provide a resist coating apparatus and a resist film forming method capable of forming a color resist film, having high film thickness uniformity, on a substrate. SOLUTION: The resist coating apparatus includes: a substrate temperature regulation section composed to regulate the temperature of the substrate so that the temperature in the periphery of the substrate is higher than the temperature in the center part of the substrate; a color resist liquid supply section which supplies a color resist liquid on the substrate temperature-regulated by the substrate temperature regulation section so that a temperature becomes higher in the periphery than the center part; and a substrate rotating section which rotates the substrate to which the color resist liquid is supplied. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5562110(B2) 申请公布日期 2014.07.30
申请号 JP20100102266 申请日期 2010.04.27
申请人 发明人
分类号 B05C11/08;B05D1/40;G02B5/20 主分类号 B05C11/08
代理机构 代理人
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