SEMICONDUCTOR PACKAGE HAVING THE HEAT SLUG ELECTRICAL SIGNAL LINE AND HEAT SPREADING FUNCTION AND A METHOD FOR PRODUCTION THEREOF

摘要

The present invention relates to a stack-type semiconductor package. A technical object to be solved is to provide a system-in-package (SIP) semiconductor package which electrically connects a lower semiconductor chip and an upper semiconductor chip using a heat spreading plate which comprises: a heat spreading layer, an insulating layer, and an electric signal layer or a package on package (PoP) semiconductor package which electrically connects an upper package and a lower package using a heat spreading plate which comprises a heat spreading layer, an insulating layer, and an electrical signal layer. The heat spreading plate has a complex function which realizes a heat spreading function and an electrical signal circuit, thereby obtaining a semiconductor package which has thin and excellent electrical properties.