发明名称 ASSEMBLING STRUCTURE FOR MODULE AND ELECTRONIC DEVICE HAVING IT
摘要 According to various embodiments of the present invention, provided are a module mounting structure and an electronic device including the same. The electronic device includes a bracket which includes an opening part for receiving a module, a support rib which is upwardly extended along the edge of the opening part and supports the outer surface of the mounted module, and at least two hitching protrusion parts which protrude from the outer surface of the module and support the module to be hitched to the bracket without complete penetration through the opening part. A part of the lower side of the module is inserted into the opening part of the bracket. An assembling property is improved and manufacturing costs are reduced by changing only the structures of the module and the bracket. Also, the electronic device is slimmed.
申请公布号 KR20140094428(A) 申请公布日期 2014.07.30
申请号 KR20130127886 申请日期 2013.10.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, JONG MIN
分类号 H05K7/14;H05K5/02 主分类号 H05K7/14
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