| 摘要 |
<p>Electronic component mounting method, electronic component mounting device and mouth data forming method Appropriate adsorption mouth can be selected corresponding to the varieties of the electronic component, eliminating absorption fault on the electronic component by the adsorption mouth. A data editing picture of the absorption mouth forming the component database data pf the selected electronic component is displayed. A contracting-limit project switch portion (35B) is displayed by the operation on a switch portion (35A), and a list of varieties of contracting-limit mouths is displayed by the operation on the contracting-limit project switch portion (35B). If the work manager checks the list and selects the absorption mouth, the CPU controls to display a mouth figure (NG) selected in a monitor and a shooting figure (DG) of the electronic component in a manner of overlying. If a designated switch portion (35D) is operated, the list of the mouth varieties converged within the range can be displayed in a rectangular figure (HG) which is used for designating a display range and overlies the mouth figure. If the work manager selects the absorption mouth that is wanted to be used, the mouth figure will be displayed.</p> |
