Semiconductor light emitting device packages and methods

摘要

A submount for a light emitting device package includes a substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.

主权项

1. A light emitting device package, comprising:
a substrate having a first surface and a second surface opposite the first surface, a first end and a second end opposite the first end; a first bond pad on the first surface of the substrate, wherein the first bond pad includes a die attach region offset from a center of the first surface toward the first end of the substrate and configured to receive a light emitting diode thereon; a second bond pad on the first surface of the substrate, wherein the second bond pad includes a bonding region that is between the first bond pad and the second end of the substrate and a second bond pad extension that continuously extends from the bonding region of the second bond pad along a side of the first surface of the substrate toward a corner of the substrate at the first end of the substrate; and first and second solder pads on the second surface of the substrate, wherein the first solder pad is adjacent the first end of the substrate and the second solder pad is adjacent the second end of the substrate, and wherein the second bond pad is in electrical contact with the first solder pad and the first bond pad is in electrical contact with the second solder pad.