发明名称 Method for manufacturing film for film capacitor
摘要 A film for film capacitors having a thickness of 10 microns or less, is manufactured by the successive steps of: mixing and preparing a forming material composed of a thermoplastic resin composition; melting and extruding the forming material to a film through a T-die; pinching and cooling the film between a pressure roll and a cooling roll having a rough surface for forming a rough surface to the film, wherein the rough surface of the cooling roll has (σ/Ra) of 0.2 or less, and the rough surface of the film has (σ/Ra) of 0.2 or less, where (Ra) is an arithmetic average roughness defined by a method specified in JIS B 0601 2001, and (σ) is a standard deviation; and rolling up the cooled film onto a winding tube in a winding unit.
申请公布号 US8790558(B2) 申请公布日期 2014.07.29
申请号 US201012969173 申请日期 2010.12.15
申请人 Shin-Etsu Polymer Co., Ltd. 发明人 Suzuki Kazuhiro;Takizawa Kenro;Yoneyama Masaru;Ishida Junya
分类号 D01D5/16 主分类号 D01D5/16
代理机构 Arent Fox LLP 代理人 Arent Fox LLP
主权项 1. A method for manufacturing a film for film capacitors having a thickness of 10 microns or less, comprising the successive steps of: mixing and preparing a forming material composed of a thermoplastic resin composition; melting and extruding the forming material to a film through a T-die; pinching and cooling the film between a pressure roll and a cooling roll having a rough surface for forming a uniform rough surface on the film, wherein the rough surface of the cooling roll has (σ/Ra) of 0.2 or less, and the uniform rough surface of the film has (σ/Ra) of 0.2 or less, where (Ra) is an arithmetic average roughness defined by a method specified in JIS B 0601 2001, and (σ) is a standard deviation; and rolling up the cooled film onto a winding tube in a winding unit, wherein the film has surface properties of (Ra) of 0.2 microns or less, (Rz/Ra) of 10 or less and a dynamic friction coefficient of 1.5 or less, where (Rz) is a maximum height defined by the method specified in JIS B 0601 2001.
地址 Tokyo JP