发明名称 Anisotropic conductive adhesive
摘要 An anisotropic conductive adhesive including conductive particles dispersed in an epoxy-based adhesive containing an epoxy compound and a curing agent gives a cured product having the elastic modulus satisfying the expressions (1) to (5), in which EM35, EM55, EM95, and EM150 are values of the elastic modulus of the cured product at 35° C., 55° C., 95° C., and 150° C., respectively, ΔEM55-95 is the rate of change in the elastic modulus between 55° C. and 95° C., and ΔEM95-150 is the rate of change in the elastic modulus between 95° C. and 150° C., 700 MPa≦EM35≦3000 MPa  (1)EM150<EM95<EM55<EM35  (2)ΔEM55-95<ΔEM95-150  (3)20%≦ΔEM55-95  (4)40%≦ΔEM95-150  (5).
申请公布号 US8790547(B2) 申请公布日期 2014.07.29
申请号 US201013517492 申请日期 2010.01.15
申请人 Dexerials Corporation 发明人 Namiki Hidetsugu;Kanisawa Shiyuki;Katayanagi Genki
分类号 H01B1/00;H01B1/20;C08L63/00 主分类号 H01B1/00
代理机构 Oliff PLC 代理人 Oliff PLC
主权项 1. An anisotropic conductive adhesive comprising: an epoxy-based adhesive containing an epoxy compound and a curing agent in an amount of 80 to 120 parts by mass based on 100 parts by mass of the epoxy compound; and conductive particles dispersed in the epoxy-based adhesive, wherein the following expressions (1) to (5) are satisfied, in which EM35, EM55, EM95, and EM150 are values of an elastic modulus of a cured product of the adhesive at 35° C., 55° C., 95° C., and 150° C., respectively, ΔEM55-95 is a rate of change in the elastic modulus between 55° C. and 95° C., and ΔEM95-150 is a rate of change in the elastic modulus between 95° C. and 150° C., 700 MPa≦EM35≦3000 MPa  (1)EM150<EM95<EM55<EM35  (2)ΔEM55-95<ΔEM95-150  (3)20%≦ΔEM55-95  (4)40%≦ΔEM95-150  (5).
地址 Tokyo JP