Current collection apparatus and method of processing for a solid oxide fuel cell thereof

摘要

A current collection apparatus and its method of processing for a solid oxide fuel cell, which mainly includes using screen printing process to print conductive adhesive onto the surface of the electrode of solid oxide fuel cell (SOFC), forming a current collection layer with drying process, using an appropriate amount of conductive adhesive to paste a conductive wire onto the current collection layer, forming an adhesion layer through drying, fixing the conductive wire on the electrode surface with an appropriate amount of ceramic adhesive, and forming a fixing layer after baking. A good connection is hence made between metal conductive wire and electrode through current collection layer, not only the interface impedance between electrode and current collection layer can be reduced effectively, but also the output power density of the SOFC unit cell can be enhanced, and stable as well as long term power output can be provided.

主权项

1. A method of processing of a current collection apparatus having reduced contact resistance between a metal conductive wire and a current collection layer for a solid oxide fuel cell, which includes at least following steps:
step A: screen-printing a conductive adhesive onto an electrode surface; step B: drying and sintering the conductive adhesive of step A so as to form a current collection layer onto the electrode covering 1-50% of the electrode surface, and the current collection layer has longitudinally and transversely interleaved grid structure having a mesh size from 150 to 300mesh with line width in a range of 0.1 mm-5 mm; step C: using the conductive adhesive to paste a metal conductive wire onto the current collection layer at a first crossing point of the interleaved grid, wherein the conductive adhesive covers the pasting area between the metal conductive wire and the current collection layer; step D: drying and sintering the conductive adhesive of step C; step E: using a ceramic adhesive to form a fixing layer so as to paste and fix the metal conductive wire on the current collection layer formed by screen-printing on the electrode surface at the first and an adjacent second crossing points of the interleaved grid; wherein the fixing layer is placed at room temperature for 16 to 20 hours so as to make mild bonding on the ceramic adhesive; step F: drying and sintering the fixing layer.