发明名称 Semiconductor device, mounted substrate to be used in semiconductor device, and manufacturing method of mounted substrate
摘要 [Problem to be Solved] A semiconductor element having fine pitch electrodes is mounted on a substrate at low cost without reducing the number of input-output terminals.;[Solution] Electrodes 1 for electrical connection and first inductors 2, arranged between the electrodes 1 in a manner neighboring the electrodes 1, for electromagnetic coupling are arranged on one main surface of the semiconductor element 3. On a substrate 5, second inductors 4 for electromagnetically coupling with the first inductors 2 are arranged in positions corresponding to the first inductors 2. The semiconductor element 3 is mounted on the substrate 5 so that the first and second inductors 2 and 4 face each other. Only desired input/output signals among input/output signals of the semiconductor element 3 are inputted or outputted from the external electrodes 11 of the substrate 5 in a manner being transmitted contactlessly by electromagnetic coupling between the first and second inductors 2 and 4 without going through the electrodes 1.
申请公布号 US8791544(B2) 申请公布日期 2014.07.29
申请号 US201013379274 申请日期 2010.06.23
申请人 NEC Corporation 发明人 Tago Masamoto
分类号 H01L27/08 主分类号 H01L27/08
代理机构 Sughrue Mion, PLLC 代理人 Sughrue Mion, PLLC
主权项 1. A semiconductor device, comprising: a semiconductor element, including: a first main surface, on which a first inductor is arranged; a second main surface; and a first electrode arranged on said first main surface or said second main surface; and a substrate, on which said semiconductor element is mounted, said substrate including: a second inductor, arranged in a position corresponding to said first inductor, for electromagnetically coupling with said first inductor; and an external electrode for inputting or outputting at least a part of signal inputted to said semiconductor element or outputted from said semiconductor element, said signal being transmitted by a contactless electromagnetic coupling between said first inductor and said second inductor, wherein said first electrode is arranged on said first main surface adjacent to said first inductor, and said first inductor and said first electrode are arranged alternately.
地址 Tokyo JP
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