发明名称 Compliant micro device transfer head with integrated electrode leads
摘要 A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring arm having integrated electrode leads that is deflectable into a space between a base substrate and the spring arm.
申请公布号 US8791530(B2) 申请公布日期 2014.07.29
申请号 US201213605959 申请日期 2012.09.06
申请人 LuxVue Technology Corporation 发明人 Bibl Andreas;Golda Dariusz
分类号 H01L27/14 主分类号 H01L27/14
代理机构 Blakely Sokoloff Taylor & Zafman LLP 代理人 Blakely Sokoloff Taylor & Zafman LLP
主权项 1. A micro device transfer head comprising: a base substrate; a spring anchor coupled to the base substrate; a spring arm coupled to the spring anchor, the spring arm including: a mesa structure suspended over the base substrate;a top electrode extending laterally from the spring anchor and over the mesa structure; anda bottom electrode extending laterally from the spring anchor underneath the mesa structure and wrapping around and over the mesa structure, wherein the top electrode and the bottom electrode are electrically isolated from each other; and a dielectric layer covering the top electrode and the bottom electrode over the mesa structure.
地址 Santa Clara CA US