Multi-chip light emitting diode modules

摘要

A multi-chip lighting module is disclosed for maximizing luminous flux output and thermal management. In one embodiment, a multi-chip module device comprises a substantially thermally dissipative substrate with a dark insulating layer deposited on a surface of the substrate. A plurality of light emitting devices is also provided. An electrically conductive layer is applied to a surface of the substrate, with the conductive layer comprising a plurality of chip carrier parts each having a surface for carrying at least one of the light emitting devices. Each light emitting device has a first and a second electrical terminal. A reflective layer is also provided that at least partially covers the conductive layer.

主权项

1. A multi-chip module device, comprising:
a substantially thermally dissipative substrate; a plurality of light emitting devices; an electrically conductive layer applied to a surface of said substrate, wherein said conductive layer comprises a plurality of chip carrier parts each having a surface for carrying at least one of said light emitting devices; a reflective coating at least partially between and at least partially surrounding two or more of said light emitting devices and at least partially covering said conductive layer; and an isolating layer disposed between said reflective coating and said conductive layer, said isolating layer at least partially surrounding two or more of said light emitting devices.