发明名称 Method for reducing wordline bridge rate
摘要 The method of forming a wordline is provided in the present invention. The proposed method includes steps of: (a) etching a metal-silicide layer and a POLY layer via a hard mask, wherein the metal-silicide layer is disposed on the POLY layer; (b) forming a POLY recess in the POLY layer; and (c) forming a liner film covering the metal-silicide layer.
申请公布号 US8791022(B2) 申请公布日期 2014.07.29
申请号 US201012952902 申请日期 2010.11.23
申请人 Macronix International Co. Ltd. 发明人 Liao Jeng-Hwa;Shieh Jung-Yu;Yang Ling-Wu
分类号 H01L21/311 主分类号 H01L21/311
代理机构 Volpe and Koenig, P.C. 代理人 Volpe and Koenig, P.C.
主权项 1. A method of forming a wordline, comprising steps of: (a) performing a wordline hard mask etch; (b) performing a wordline metal-silicide etch to form a polysilicon layer recess under an interface of a metal-silicide layer and a polysilicon layer having a top portion; (c) performing a liner deposition; (d) performing a liner and polysilicon layer etch to form a liner film covering the metal-silicide layer and the top portion; and (e) performing a hot standard clean 1 (SC1) dip to form a T-shaped polysilicon layer.
地址 TW