发明名称 |
Method for reducing wordline bridge rate |
摘要 |
The method of forming a wordline is provided in the present invention. The proposed method includes steps of: (a) etching a metal-silicide layer and a POLY layer via a hard mask, wherein the metal-silicide layer is disposed on the POLY layer; (b) forming a POLY recess in the POLY layer; and (c) forming a liner film covering the metal-silicide layer. |
申请公布号 |
US8791022(B2) |
申请公布日期 |
2014.07.29 |
申请号 |
US201012952902 |
申请日期 |
2010.11.23 |
申请人 |
Macronix International Co. Ltd. |
发明人 |
Liao Jeng-Hwa;Shieh Jung-Yu;Yang Ling-Wu |
分类号 |
H01L21/311 |
主分类号 |
H01L21/311 |
代理机构 |
Volpe and Koenig, P.C. |
代理人 |
Volpe and Koenig, P.C. |
主权项 |
1. A method of forming a wordline, comprising steps of:
(a) performing a wordline hard mask etch; (b) performing a wordline metal-silicide etch to form a polysilicon layer recess under an interface of a metal-silicide layer and a polysilicon layer having a top portion; (c) performing a liner deposition; (d) performing a liner and polysilicon layer etch to form a liner film covering the metal-silicide layer and the top portion; and (e) performing a hot standard clean 1 (SC1) dip to form a T-shaped polysilicon layer. |
地址 |
TW |