Method of manufacturing optical sensor, optical sensor, and camera including optical sensor

摘要

A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting α rays, an amount of the α rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.

主权项

1. A method of manufacturing an optical sensor, comprising:
providing a semiconductor wafer including a plurality of pixel areas; providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of the plurality of light transmissive members emitting α rays, an amount of the α rays being smaller than or equal to 0.05 c/cm2·h (counts per square centimeter per hour); fixing the light transmissive substrate onto the semiconductor wafer by a fixing member so that the plurality of light transmissive members and the semiconductor wafer face each other; and dividing the fixed semiconductor wafer and the light transmissive substrate into individual pieces, wherein the light transmissive members are formed of silicate glass.