Semiconductor device having groove-shaped via-hole

摘要

The semiconductor device has insulating films 40, 42 formed over a substrate 10; an interconnection 58 buried in at least a surface side of the insulating films 40, 42; insulating films 60, 62 formed on the insulating film 42 and including a hole-shaped via-hole 60 and a groove-shaped via-hole 66a having a pattern bent at a right angle; and buried conductors 70, 72a buried in the hole-shaped via-hole 60 and the groove-shaped via-hole 66a. A groove-shaped via-hole 66a is formed to have a width which is smaller than a width of the hole-shaped via-hole 66. Defective filling of the buried conductor and the cracking of the inter-layer insulating film can be prevented. Steps on the conductor plug can be reduced. Accordingly, defective contact with the upper interconnection layer and the problems taking place in forming films can be prevented.

主权项

1. A semiconductor device comprising:
a rectangular semiconductor substrate which includes a semiconductor circuit region and four corners; a first insulating film which is planarized and which includes silicon, oxygen and carbon formed above the rectangular semiconductor substrate; a first conductive layer, which includes a first tantalum based film and a first copper film, formed in the first insulating film; a second insulating film which includes silicon and nitrogen, formed above the first insulating film and the first conductive layer; a third insulating film which includes silicon and oxygen, formed above the second insulating film; a fourth insulating film which includes silicon and nitrogen, formed above the third insulating film; a fifth insulating film which is planarized, formed above the fourth insulating film, and which includes silicon and oxygen; and a second conductive layer formed in the fourth insulating film and the fifth insulating film, a plurality of guard rings surrounding the semiconductor circuit region; wherein: the guard rings comprise a groove-shaped via formed in the second insulating film and the third insulating film; the groove-shaped via and the second conductive layer include a second tantalum based film and a second copper film; the first conductive layer, the groove-shaped via and the second conductive layer include patterns bent twice each time at an angle of larger than 90 degree at each of the four corners; and the patterns are bent totally at 90 degree at each of the four corners of the rectangular semiconductor substrate.