发明名称 Coating treatment method and coating treatment apparatus
摘要 In the present invention, a masking solution is supplied to an edge portion of a front surface of a substrate rotated around a vertical axis to form a masking film at the edge portion of the substrate, a hard mask solution is supplied to the front surface of the substrate to form a hard mask film on the front surface of the substrate, a hard mask film removing solution dissolving the hard mask film is supplied to the hard mask film formed at the edge portion of the substrate to remove the hard mask film formed at the edge portion of the substrate, and a masking film removing solution dissolving the masking film is supplied to the masking film to remove the masking film at the edge portion of the substrate.
申请公布号 US8791030(B2) 申请公布日期 2014.07.29
申请号 US201313952739 申请日期 2013.07.29
申请人 Tokyo Electron Limited 发明人 Iwao Fumiko;Shimura Satoru;Yoshihara Kousuke
分类号 H01L21/31;C23C16/00 主分类号 H01L21/31
代理机构 Posz Law Group, PLC 代理人 Posz Law Group, PLC
主权项 1. A coating treatment method of applying a hard mask solution to a front surface of a substrate to form a hard mask film, comprising: a masking film forming step of supplying a masking solution to an edge portion of the front surface of the substrate rotated around a vertical axis to form a masking film at the edge portion of the substrate; a hard mask film forming step of supplying the hard mask solution to the front surface of the substrate to form the hard mask film on the front surface of the substrate; a hard mask film removing step of supplying a hard mask film removing solution dissolving the hard mask film to the hard mask film formed at the edge portion of the substrate to remove the hard mask film at the edge portion of the substrate; and a masking film removing step of supplying a masking film removing solution dissolving the masking film to the masking film to remove the masking film at the edge portion of the substrate.
地址 Tokyo JP
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