发明名称 Silicon-containing film, resin composition, and pattern formation method
摘要 A pattern-forming method includes forming a silicon-containing film on a substrate, the silicon-containing film having a mass ratio of silicon atoms to carbon atoms of 2 to 12. A shape transfer target layer is formed on the silicon-containing film. A fine pattern is transferred to the shape transfer target layer using a stamper that has a fine pattern to form a resist pattern. The silicon-containing film and the substrate are dry-etched using the resist pattern as a mask to form a pattern on the substrate in nanoimprint lithography. According to another aspect of the invention, a silicon-containing film includes silicon atoms and carbon atoms. A mass ratio of silicon atoms to carbon atoms is 2 to 12. The silicon-containing film is used for a pattern-forming method employed in nanoimprint lithography.
申请公布号 US8791020(B2) 申请公布日期 2014.07.29
申请号 US201113193555 申请日期 2011.07.28
申请人 JSR Corporation 发明人 Mori Takashi;Tanaka Masato;Nishimura Yukio;Yamaguchi Yoshikazu
分类号 H01L21/311 主分类号 H01L21/311
代理机构 Ditthavong & Steiner, P.C. 代理人 Ditthavong & Steiner, P.C.
主权项 1. A pattern-forming method comprising: forming a silicon-containing film on a substrate, the silicon-containing film having a mass ratio of silicon atoms to carbon atoms of 2 to 12; forming a shape transfer target layer on the silicon-containing film; transferring a fine pattern to the shape transfer target layer using a stamper that has a fine pattern to form a resist pattern; and dry-etching the silicon-containing film and the substrate using the resist pattern as a mask to form a pattern on the substrate in nanoimprint lithography.
地址 Tokyo JP