发明名称 |
Silicon-containing film, resin composition, and pattern formation method |
摘要 |
A pattern-forming method includes forming a silicon-containing film on a substrate, the silicon-containing film having a mass ratio of silicon atoms to carbon atoms of 2 to 12. A shape transfer target layer is formed on the silicon-containing film. A fine pattern is transferred to the shape transfer target layer using a stamper that has a fine pattern to form a resist pattern. The silicon-containing film and the substrate are dry-etched using the resist pattern as a mask to form a pattern on the substrate in nanoimprint lithography. According to another aspect of the invention, a silicon-containing film includes silicon atoms and carbon atoms. A mass ratio of silicon atoms to carbon atoms is 2 to 12. The silicon-containing film is used for a pattern-forming method employed in nanoimprint lithography. |
申请公布号 |
US8791020(B2) |
申请公布日期 |
2014.07.29 |
申请号 |
US201113193555 |
申请日期 |
2011.07.28 |
申请人 |
JSR Corporation |
发明人 |
Mori Takashi;Tanaka Masato;Nishimura Yukio;Yamaguchi Yoshikazu |
分类号 |
H01L21/311 |
主分类号 |
H01L21/311 |
代理机构 |
Ditthavong & Steiner, P.C. |
代理人 |
Ditthavong & Steiner, P.C. |
主权项 |
1. A pattern-forming method comprising:
forming a silicon-containing film on a substrate, the silicon-containing film having a mass ratio of silicon atoms to carbon atoms of 2 to 12; forming a shape transfer target layer on the silicon-containing film; transferring a fine pattern to the shape transfer target layer using a stamper that has a fine pattern to form a resist pattern; and dry-etching the silicon-containing film and the substrate using the resist pattern as a mask to form a pattern on the substrate in nanoimprint lithography. |
地址 |
Tokyo JP |