Array substrate, manufacturing method of the same, and fabricating method of display device including the array substrate

摘要

An array substrate for a display device includes an insulation substrate, a gate line formed on the insulation substrate, a data line crossing the gate line to define a pixel area, a thin film transistor including a gate electrode connected to the gate line, a source electrode connected to the data line, and a drain electrode, a passivation layer covering the gate line, the data line and the thin film transistor and including a drain contact hole to expose the drain electrode, and a pixel electrode formed on the pixel area and being connected to the drain contact hole through the drain contact hole. Each of the data line, the source electrode and the drain electrode includes a lower layer having copper and an upper layer covering upper and side surfaces of the lower layer, and the upper layer is thinner than the lower layer.

主权项

1. An array substrate for a display device, comprising:
a substrate; a gate pad, a gate electrode, and a gate line formed on the substrate; a gate insulation layer formed over the gate pad, the gate electrode, and the gate line; a semiconductor layer formed on the gate insulation layer; a drain electrode and a source electrode formed on the semiconductor layer, a thin film transistor including the gate electrode, the drain electrode, and the source electrode; a data line formed on the gate insulation layer and crossing the gate line to define a pixel area, the data line coupled to the source electrode; a passivation layer formed over the data line, the source electrode, the drain electrode, and a portion of the gate insulation layer, the passivation layer including a drain contact hole to expose the drain electrode; and a pixel electrode formed on the passivation layer in the pixel area and connected to the drain electrode through the drain contact hole, and wherein each of the data line, the source electrode, and the drain electrode includes a lower layer having copper and an upper layer covering upper and side surfaces of the lower layer, and wherein the upper layer is thinner than the lower layer.