| 摘要 |
Provided are a wafer dicing laser processing device and a wafer dicing method using the same. The wafer dicing laser processing device according to an embodiment of the present invention includes a beam generator for generating laser beam; a condensing unit for concentrating the laser beam from the beam generator on a wafer; a liquid crystal on silicon (LCoS) which is arranged on the light path of the laser beam between the beam generator and the condensing unit and outputs pattern images changing the polarization characteristics of the laser beam; and a control unit which is connected to the LCoS and applies a signal for controlling the pattern images to the LCoS. |
