| 发明名称 |
Wafer backside coating process with pulsed UV light source |
| 摘要 |
A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation. |
| 申请公布号 |
US8791033(B2) |
申请公布日期 |
2014.07.29 |
| 申请号 |
US201213707941 |
申请日期 |
2012.12.07 |
| 申请人 |
Henkel IP & Holding GmbH |
发明人 |
Gasa Jeffrey;Phan Dung Nghi;Leon Jeffrey;Hajela Sharad;Kong Shengqian |
| 分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
Bauman Steven C. |
| 主权项 |
1. A process for coating a semiconductor wafer with a coating composition comprising:
(A) providing a coating composition; (B) disposing the coating composition onto the semiconductor wafer; and (C) B-stage curing the coating composition by exposing the composition to pulsed UV light in an amount sufficient to cure the coating composition,in which the coating composition comprises (i) a solid epoxy resin with a melting point between 80° C. and 130° C., and (ii) a polymeric mercaptan-pendant silicone having the structurein which n is an integer between 5 and 500, and m is an integer of 1 to 5. |
| 地址 |
Duesseldorf DE |
