Adhesive composition for labels

摘要

Provided is an adhesive composition for labels, which can be easily applied at a relatively low temperature and has satisfactory die cutting properties so that the adhesive composition can contribute to an improvement of the productivity of labels, and which is capable of producing labels having excellent holding power and tackiness. There is disclosed an adhesive composition for labels comprising: a block copolymer A represented by the following general formula (A); a polymer C, which is a polymer having a glass transition temperature of −30° C. or lower, or a block copolymer that has a polymer block having a glass transition temperature of −30° C. or lower at an end of the polymer chain; and a tackifier resin D.
Ar1a-Da-Ar2a  (A),
in the general formula (A), Ar1a represents an aromatic vinyl polymer block having a weight average molecular weight of 6,000 to 20,000; Ar2a represents an aromatic vinyl polymer block having a weight average molecular weight of 22,000 to 400,000; and Da represents a conjugated diene polymer block having a vinyl bond content of 1 mol % to 20 mol %.

主权项

1. An adhesive composition for labels comprising:
a block copolymer A represented by the following general formula (A); a polymer C, which is a polymer having a glass transition temperature of −30° C. or lower, or a block copolymer that has a polymer block having a glass transition temperature of −30° C. or lower at an end of a polymer chain; and a tackifier resin D;
Ar1a-Da-Ar2a  (A), in the general formula (A), Ar1a represents an aromatic vinyl polymer block having a weight average molecular weight of 6,000 to 20,000; Ar2a represents an aromatic vinyl polymer block having a weight average molecular weight of 22,000 to 400,000; a ratio (Mw(Ar2a)/Mw(Ar1a)) of the weight average molecular weight (Mw(Ar2a)) of the aromatic vinyl polymer block (Ar2a) and the weight average molecular weight (Mw(Ar1a)) of the aromatic vinyl polymer block (Ar1a) is 1.5 to 67; and Da represents a conjugated diene polymer block having a vinyl bond content of 1 mol % to 20 mol %.