Device having multiple wire bonds for a bond area and methods thereof

摘要

Wire bonds are formed at an integrated circuit device so that multiple wires are bonded to a single bond pad. In a particular embodiment, the multiple wires are bonded by first applying a stud bump to the pad and successively bonding each of the wires to the stud bump. Another stud bump can be placed over the bonded wires to provide additional connection security.

主权项

1. A method comprising:
bonding a first plurality of wires to a first stud bump on a first bond pad of an integrated circuit device; bonding a second plurality of wires to a second stud bump on a second bond pad of the integrated circuit device; and applying a third stud bump over the first plurality of wires bonded, wherein at least one wire from the second plurality of wires bonds to a top portion of the third stud bump.