Method for integrating an electronic component into a printed circuit board

摘要

This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

主权项

1. A method for integrating at least one electronic component into a printed circuit board, comprising the following steps:
providing a layer of a printed circuit board for supporting an electronic component, applying an adhesive to a surface of the layer, fixing the electronic component on the layer by means of the adhesive, after fixing the electronic component to the layer, applying an insulating material to surround the electronic component at all sides of the electronic component except for the side of the electronic component that is fixed to the layer, applying or arranging at least one electrically conductive layer on or at the insulating material, on a side or surface of the insulating material that is remote from the adhesive, and patterning the electrically conductive layer in accordance with contacts of the electronic component or in accordance with conductor tracks to be formed on the printed circuit board and electrically connecting the contacts of the electronic component to the patterned conductive layer,wherein on a side of the electronic component remote from the electrically conductive layer in a region of fixation of the electronic component, at least one opening is formed for exposing a portion of the electronic component and for removal of heat.