| 摘要 |
<p>An LED package is disclosed. The LED package includes a base where an LED chip is mounted, a sealing material made of a transparent resin to seal the LED chip, and a housing surrounding the side of the sealing material to expose the upper part of the sealing material. The sealing material is formed by transfer molding using a mold having a predetermined shape. Also, the housing has a transparent property.</p> |
