发明名称 |
Contact assembly for an electrical connector and method of manufacturing the contact assembly |
摘要 |
A contact assembly includes a conductive substrate, a composite layer, and a conductive layer. The conductive substrate is configured to form a conductive path of the electrical connector. The composite layer is engaged to the conductive substrate and includes a dielectric material with a conductive filler material dispersed within the dielectric material at a concentration that is lower than a percolation threshold concentration of the composite layer. The conductive layer is engaged to the composite layer. The conductive substrate, the composite layer, and the conductive layer form a capacitive element through which a signal propagation path between the conductive substrate and a mating contact that mates with the conductive layer passes. |
申请公布号 |
US8790144(B2) |
申请公布日期 |
2014.07.29 |
申请号 |
US201213399528 |
申请日期 |
2012.02.17 |
申请人 |
Tyco Electronics Corporation |
发明人 |
Malervy Elizabeth Sullivan |
分类号 |
H01R13/02;H01R9/24;C25D13/02;H01G4/40;C25D5/10;C25D9/04;H01G4/35;H01G13/00;H01R43/16;C25D13/04;C25D9/02;C25D9/08;H01G4/12;H01R13/03;C25D15/02;H01L49/02 |
主分类号 |
H01R13/02 |
代理机构 |
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代理人 |
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主权项 |
1. A contact assembly for an electrical connector, the contact assembly comprising:
a conductive substrate configured to form a conductive path of the electrical connector; a composite layer engaged to the conductive substrate, the composite layer including a dielectric material with a conductive filler material dispersed within the dielectric material at a concentration that is lower than a percolation threshold concentration of the composite layer; and a conductive layer engaged to the composite layer, wherein the conductive substrate, the composite layer, and the conductive layer form a capacitive element through which a signal propagation path between the conductive substrate and a mating contact that mates with the conductive layer passes. |
地址 |
Berwyn PA US |