发明名称 Contact assembly for an electrical connector and method of manufacturing the contact assembly
摘要 A contact assembly includes a conductive substrate, a composite layer, and a conductive layer. The conductive substrate is configured to form a conductive path of the electrical connector. The composite layer is engaged to the conductive substrate and includes a dielectric material with a conductive filler material dispersed within the dielectric material at a concentration that is lower than a percolation threshold concentration of the composite layer. The conductive layer is engaged to the composite layer. The conductive substrate, the composite layer, and the conductive layer form a capacitive element through which a signal propagation path between the conductive substrate and a mating contact that mates with the conductive layer passes.
申请公布号 US8790144(B2) 申请公布日期 2014.07.29
申请号 US201213399528 申请日期 2012.02.17
申请人 Tyco Electronics Corporation 发明人 Malervy Elizabeth Sullivan
分类号 H01R13/02;H01R9/24;C25D13/02;H01G4/40;C25D5/10;C25D9/04;H01G4/35;H01G13/00;H01R43/16;C25D13/04;C25D9/02;C25D9/08;H01G4/12;H01R13/03;C25D15/02;H01L49/02 主分类号 H01R13/02
代理机构 代理人
主权项 1. A contact assembly for an electrical connector, the contact assembly comprising: a conductive substrate configured to form a conductive path of the electrical connector; a composite layer engaged to the conductive substrate, the composite layer including a dielectric material with a conductive filler material dispersed within the dielectric material at a concentration that is lower than a percolation threshold concentration of the composite layer; and a conductive layer engaged to the composite layer, wherein the conductive substrate, the composite layer, and the conductive layer form a capacitive element through which a signal propagation path between the conductive substrate and a mating contact that mates with the conductive layer passes.
地址 Berwyn PA US