| 发明名称 | Sealed elastomer bonded Si electrodes and the like for reduced particle contamination in dielectric etch | ||
| 摘要 | An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing having a backing member having a bonding surface, an inner electrode having a lower surface on one side and a bonding surface on the other side, and an outer electrode having a lower surface on one side and a bonding surface on the other side. At least one of the electrodes has a flange, which extends underneath at least a portion of the lower surface of the other electrode. | ||
| 申请公布号 | US8789493(B2) | 申请公布日期 | 2014.07.29 |
| 申请号 | US200611352307 | 申请日期 | 2006.02.13 |
| 申请人 | Lam Research Corporation | 发明人 | Ren Daxing;Magni Enrico;Lenz Eric;Zhou Ren |
| 分类号 | C23C16/50;H01L21/306;C23F1/00 | 主分类号 | C23C16/50 |
| 代理机构 | Buchanan Ingersoll & Rooney PC | 代理人 | Buchanan Ingersoll & Rooney PC |
| 主权项 | 1. An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing comprising: a backing member having a bonding surface; an inner electrode having a lower surface, which is configured to be exposed to a plasma zone on one side and a bonding surface on the other side; an outer electrode having a lower surface, which is configured to be exposed to the plasma zone on one side and a bonding surface on the other side, and wherein at least one of the electrodes has a flange which extends underneath at least a portion of the lower surface of the other electrode; and a bonding material, which partially fills a portion of an interface between the inner and outer electrodes and wherein the at least one flange eliminates a line of sight from the plasma zone to the bonding material. | ||
| 地址 | Fremont CA US | ||