| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal diffusion member for diffusing heat from a heating element in a housing, and an electronic apparatus equipped with the same.SOLUTION: A thermal diffusion member 30 is mounted in an electronic apparatus including a housing 46 carrying a plurality of electronic components in the inside thereof, and a lid 50 that is provided in at least a part of a lower part of the housing 46 and is removable from the housing 46. The thermal diffusion member 30 includes: a high heat conduction layer 11 having high thermal conductivity; and a low heat conduction layer 12 laid on top of the high heat conduction layer 11 while having low thermal conductivity, the low thermal conduction layer 12 is brought into contact with or bonded to the surface of the lower part in the housing 46 excluding the lid 50, and a high heat conduction extending part formed by extending the high heat conduction layer 11 is brought into contact with or bonded to a structure provided in the inside of the housing 46. |
