发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SUBSTRATE PROCESSING SYSTEM
摘要 PROBLEM TO BE SOLVED: To shorten the time to use an accelerator for forming an n-layer.SOLUTION: A method of manufacturing a semiconductor device comprises: an irradiation step (S10) of irradiating a substrate with a particle beam by an accelerator; and an annealing step (S12) of heat-treating the substrate in an atmosphere containing hydrogen in order to form an n-layer in the substrate. In the irradiation step (S10), the substrate is irradiated with the particle beam containing hydrogen ions so as not to reach the hydrogen quantity required for forming the n-layer, or the substrate is irradiated with the particle beam containing no hydrogen ion.
申请公布号 JP2014138173(A) 申请公布日期 2014.07.28
申请号 JP20130007644 申请日期 2013.01.18
申请人 SHI EXAINATION & INSPECTION LTD 发明人 ITO SEISHI;SAKANE JIN
分类号 H01L21/265;H01L21/336;H01L29/739;H01L29/78 主分类号 H01L21/265
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