| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a through-hole substrate, in which even when a through-hole is partially filled with a photosensitive resin, the substrate can be processed for patterning under conditions close to the conditions when no through-hole is present.SOLUTION: In one embodiment of the method for manufacturing a through-hole substrate, a photosensitive resin layer is formed on a first surface side of a substrate having a through-hole that penetrates the first surface and a second surface, so as to fill a part of the through-hole; at least a part of the photosensitive resin layer is exposed on the first surface side of the substrate; and a developing solution is supplied on the first surface side of the substrate to develop the photosensitive resin layer. After the photosensitive resin layer is formed, a dissolving solution is supplied on the second surface side of the substrate to the through-hole so as to dissolve at least a part of the photosensitive resin layer filling the through-hole. |
