| 摘要 |
PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition having excellent adhesiveness to copper and a copper alloy.SOLUTION: The positive photosensitive resin composition comprises (a) a resin described below, (b) a quinonediazide compound, (c) a thermal crosslinking agent, and (d) a solvent. In (a) the resin, the sum of numbers of structural units expressed by general formula (1) and by general formula (2) is 50% or more of the number of the whole structural units; and p/(p+q), where p is the number of structural units expressed by general formula (1) and q is the number of structural units expressed by general formula (2), ranges from 0.60 to 0.95. |
