| 摘要 |
<p>An embodiment of the present invention provides a plate provided at a dual side wafer grinding device for grinding a wafer. The plate includes an upper plate positioned over the wafer; a lower plate positioned below the wafer to be opposite to the upper plate; a carrier interposed between the upper plate and the lower plate, with the wafer being attached to the carrier; and an internal gear provided at an outer peripheral side of the lower plate and a sun gear provided at an inner peripheral side of the lower plate. The top surface of the lower plate is provided with a plurality of first plate grooves formed in a first direction, and a plurality of second plate grooves formed in a second direction different from the first direction, wherein the first plate grooves and the second plate grooves are formed to be inclined at a preset angle.</p> |
