发明名称 INJECTION MOLDING DEVICE AND INJECTION MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an injection molding technique capable, even in a case where no case (container) is needed, of easily molding a product having a high molding precision within a brief period at a low cost.SOLUTION: The provided injection molding device capable, on an occasion for manufacturing a specified product by injecting and curing a liquid resin material, of setting the molding pressure thereof at approximately 0.5 MPa is furnished with a mold 2 where a molding target is settable in the interior thereof, a mold fastening unit 4 for fastening the mold, and an injection unit 6 for injecting a resin material into the fastened mold. An injection cylinder 6s including a nozzle 6t linked and connected to the mold for injecting the resin material toward the mold interior is configured on the injection unit while including a cooling mechanism for cooling the nozzle at a specified temperature.
申请公布号 JP2014136312(A) 申请公布日期 2014.07.28
申请号 JP20130004292 申请日期 2013.01.15
申请人 MATSUDA SEISAKUSHO:KK;KYOCERA CHEMICAL CORP;FUJI TOKUSHU KANAGATA KK 发明人 SATO SETSUO;MORI TADASHI;MASUKO RYOICHI;NAKAMURA TOMOKI;FUJIURA HIROSHI;ASANO YUKARI;FUSE YOSHIHISA
分类号 B29C45/02;B29C45/27 主分类号 B29C45/02
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