| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a coil device which can dissipate the heat generated from a layer other than the lowermost layer efficiently to a metal housing.SOLUTION: A coil device includes a metal housing 1, and a printed wiring board 4 having a core 2 fixed to the metal housing 1, and coil patterns 7, 8 coupling magnetically with the core 2. Heat generated from the coil pattern 8 of the lowermost printed wiring layer 401 is dissipated to the metal housing 1 via an insulating heat dissipation sheet 5. Heat generated from the coil pattern 7 of the printed wiring layer 402 other than the lowermost layer is dissipated to the metal housing 1 via through holes 44, 67 and an insulating heat dissipation sheet 65.</p> |
