| 摘要 |
<p>PROBLEM TO BE SOLVED: To resolve a problem that, although thinning a semiconductor substrate is effective for improving performance of a semiconductor device, and a method of fixing a reinforcement member onto a surface of the semiconductor substrate via an adhesive agent layer and then processing a rear face is widespread, in this case, a step of removing the adhesive agent is required, which is wasteful.SOLUTION: When the adhesive agent layer is removed, the adhesive agent layer is residually left in a partial range, and the residual part is utilized for a protection film and the like. Since a removal step of an adhesive agent also serves as a part of a formation step and the like of the protection film, the part of the formation step and the like of the protection film can be omitted, and waste can be reduced.</p> |
