| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a reflow soldering method preventing electronic components or the like on a substrate from being damaged, and suppressing deterioration in solder and flux of a solder paste, and a reflow device in which the reflow soldering method is performed.SOLUTION: In a reflow soldering method, by rotating a fan in the lower part of a conveyance path where a workpiece is conveyed in a reflow furnace, without rotating a fan in the upper part of the conveyance path, air is blown toward a heater and hot blast is blown toward the lower face of the workpiece to perform soldering. A plate for radiating far infrared rays toward the workpiece is mounted on the heater.</p> |
