METHOD FOR FORMING THROUGH VIA AND METHOD FOR MANUFACTURING ELECTRONIC PRODUCT

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a through via capable of suppressing copper from diffusing even when copper is used for a conductor and suppressing a substrate from being warped even when the thickness of the substrate becomes thin.SOLUTION: A method for manufacturing a through via comprises the steps of: forming a hole-like trench 3 from a surface of a substrate 1 toward the inside of the substrate 1; forming a first insulating film 4 in the trench 3; forming a conductor film 6V which serves as the through via in the trench 3 in which the first insulating film 4 is formed; protruding the first insulating film 4 including the conductor film 6V inside from a rear surface of the substrate 1 by retreating the rear surface of the substrate 1; forming a second insulating film 9 on the rear surface of the substrate 1 and the first insulating film 4 protruded from the rear surface of the substrate 1; and exposing the conductor film 6V to the outside by retreating the second insulating film 9, the first insulating film 4 and the conductor film 6V. The second insulating film 9 is formed of a polymer membrane.