THERMAL PRINTER HEAD MANUFACTURING DEVICE, AND MOLDING METHOD THEREOF USING A METAL MASK

摘要

The present invention relates to a thermal printer head manufacturing device for forming an IC chip for controlling the power supply on a substrate when a thermal printer head is manufactured, and for accurately and easily molding a heat-resistant resin on the IC chip by using a metal mask when molding by using a heat resistant resin such as epoxy or the like; and a molding method using the metal mask. According to an embodiment of the present invention, the thermal printer head manufacturing device comprises: a stage for fixing a substrate; a metal mask for forming a supplying hole in the location corresponding to the IC chip bonded by wire bonding or flip bonding on the substrate fixed to the stage, and arranged in the substrate to supply the heat resistant resin to the IC chip through the supplying hole; and a molding machine for molding the IC chip by using the heat resistant resin by supplying the heat resistant resin to the supplying hole since the heat resistant resin is transferred by pushing the heat resistant resin placed on the metal mask.