| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which enables formation of a film with low dielectric constant.SOLUTION: There is provided a photosensitive resin composition comprising a polymer composed of a copolymer of a specific structure, a thermosetting crosslinking agent, and a photosensitizer. The photosensitive resin composition is applied, and heated at 230°C for 60 minutes to form a film with the thickness of 2 μm, and thereafter, relative dielectric constant measured at the frequency of 10 kHz is 4.0 or less. |
