发明名称 LAMINATION TYPE ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT BUILT-IN WIRING PLATE
摘要 <p>PROBLEM TO BE SOLVED: To provide a lamination type electronic component in which consideration of directions of front and rear surfaces thereof is unnecessary in a loading process to a wiring plate or the like, and an electronic component built-in wiring plate incorporating the same.SOLUTION: In a lamination type electronic component which is formed by lamination while insulating a first conductor and a second conductor, first external electrodes 11, 12 conducted with the first conductor and second external electrodes 21, 22 conducted with the second conductor are respectively formed on a first principal surface A and a second principal surface B on both ends in the lamination direction. The first external electrodes 11, 12 and the second external electrodes 21, 22 are not brought into contact with each other. The first external electrode 11 and the second external electrode 21 are arranged facing diagonal corners, the first external electrode 12 is arranged facing the corner adjacent to the corner just behind the first external electrode 11, and the second external electrode 22 is arranged facing the corner diagonal to the corner faced by the first external electrode 12. In an electronic component built-in wiring plate incorporating the electronic component, a wiring pattern and the external electrode of the lamination type electronic component are connected by a via.</p>
申请公布号 JP2014138172(A) 申请公布日期 2014.07.28
申请号 JP20130007621 申请日期 2013.01.18
申请人 IBIDEN CO LTD 发明人 MITSUMA MASAHIRO;NIWA MASAFUMI;FURUYA TOSHIKI
分类号 H01G4/30;H01G4/232;H05K3/46 主分类号 H01G4/30
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