| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device for induction heating only a solder for connecting a substrate to a terminal, and a semiconductor device manufacturing method.SOLUTION: A soldering device includes: a heating coil 12; a power supply 16 supplying an alternating-current to the heating coil 12; a stage 20 on which a semiconductor device is mounted; a magnetic member 14 covering the heating coil 12 while exposing a surface of the heating coil 12 opposed to the stage 20; and a control device 18 controlling the power supply 16. |
