| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable reduction in thermal noise.SOLUTION: A semiconductor device manufacturing method comprises: arranging a front end IC 23 on an organic substrate 21 and subsequently forming a mold molding part 26, in which the mold molding part 26 uses an epoxy thermosetting resin having high radiation performance, for example, and includes a peripheral part 26b higher than a central part 26a and a cavity for housing a solid state image pickup element 24 on the central part 26a; and further adhering a glass part 25 on the peripheral part 26b after arranging the solid state image pickup element on the central part 26a. The present art can be applied to a solid state image pickup device.</p> |
