| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light emitting element package-fixing structure capable of relaxing a required processing accuracy and reducing the cost of manufacture.SOLUTION: A semiconductor light emitting element package 1 is fixed by being sandwiched by a mount 5 and a holder 6 integrally formed or coupled with a heat sink 51. At this time, a bottom face S121 of a base 12 and an upper surface S5 of the mount 5 are directly contacted with each other, and an upper surface S122 of the base 12 and an inside bottom face S61 of the holder 6 are directly contacted with each other. However, the upper surface S5 of the mount 5 and an outside bottom face S62 of the holder 6 are not contacted with each other. A thermal interface material (TIM) layer 7 is inserted into an air gap between the upper surface S5 of the mount 5 and the outside bottom face S62 of the holder 6 to increase an allowable tolerance between the upper surface S5 of the mount 5 and the outside bottom face S62 of the holder 6. A thermal conductive elastic member 8 is inserted between a lateral face of the base 12 and the inside bottom face of the holder 6. |
