| 摘要 |
<p>PURPOSE: A semiconductor package having functions of wireless signal transmission and wireless power driving are provided to reduce costs for a semiconductor package without wire or ball. CONSTITUTION: In a semiconductor package having functions of wireless signal transmission and wireless power driving, a substrate(1) comprises a base part(10), a wireless power supply unit(30), and a substrate wireless signal part(40). The base part comprises a first side(12) and a second side(14). A wireless power supply unit supplies power to the base part and a semiconductor chip The wireless power supply unit receives power through a non-radiative method using magnetic field resonance The wireless power supply unit includes a power transmitter and a power receiver.</p> |
