| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for forming a conductive pattern capable of improving adhesion between the substrate and the conductive pattern, a conductive pattern-formed substrate, and a method for manufacturing the conductive pattern-formed substrate.SOLUTION: A metal thin film 2 with a level of exhibiting no conductivity (non-conductive level) is formed by means of conventional methods including a vacuum deposition method, a sputtering method, an ion plating method or the like so that the mass per unit area of nickel, chromium or an alloy thereof is 4 μg/cmor more and less than 50 μg/cm, preferably, 4 μg/cmor more and less than 20 μg/cm, on a surface of a substrate 1 comprising a resin such as polyethylene terephthalate. When an ink composition containing metal particles or metal oxide particles is printed in a predetermined pattern shape 3P on the metal thin film, and then converted into a conductive pattern 3 with light irradiation, the metal thin film functions as a layer for improving adhesion between the metal or metal oxide particles and the substrate 1. |
