| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermally conductive composite sheet highly bonded to an IC ship in mounting, capable of promptly transferring heat generated from the IC chip to a thermally conducting layer, and capable of dissipating the heat through the thermally conducting layer.SOLUTION: A thermally conductive composite sheet is obtained by stacking a thermally conductive adhesive layer having a thermal conductivity of 0.4 W/mK or more on at least one face of a thermally conducting layer having a thermal conductivity of 20-2,000 W/mK in the plane direction thereof. |
