PAD STRUCTURES AND WIRING STRUCTURES IN VERTICAL TYPE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide pad structures and wiring structures including the pad structures in a vertical type semiconductor device that can be formed by a simple process.SOLUTION: A pad structure in a vertical type semiconductor device includes: a first conductive line which includes first pad regions at an upper surface of an edge portion and has a line shape with an end portion extended to a first position; and a second conductive line which is provided over and separated from the first conductive line, includes second pad regions at an upper surface of an edge portion, has a line shape with an end portion extended to the first position, and has a dent portion at a portion facing the first pad regions in a vertical direction so as to expose the first pad regions.