发明名称 SUBSTRATE HOUSING AND PROCESSING DEVICE AND SUBSTRATE HOUSING AND PROCESSING METHOD, AND STORAGE MEDIUM FOR SUBSTRATE HOUSING AND PROCESSING
摘要 PROBLEM TO BE SOLVED: To provide a substrate housing and processing device and a substrate housing and processing method which can ensure safety of transfer of a processed substrate by having a confirmation function of the locking of a lid after housing the processed substrate, and to provide a storage medium for substrate housing and processing.SOLUTION: A processed wafer W is housed in a cassette 10 based on a control signal from control means, and after the opening 10b of the cassette is closed by a lid 10c, a lid attachment/detachment mechanism 30 is retracted from a lid close position to a lid open position in a state not holding the lid 10c. Thereafter, the lid open position of the lid attachment/detachment mechanism 30 is detected by means of a lid attachment/detachment mechanism open sensor 38b, and abnormality of lid close state of the lid 10c is determined by lid abnormality detection sensors 39a, 39b. In a state where the lid attachment/detachment mechanism 30 retracted from the lid close position is moved again to the lid close position, the keyhole 10d of the lid 10c is engaged with the key 31 of the lid attachment/detachment mechanism 30.
申请公布号 JP2014138011(A) 申请公布日期 2014.07.28
申请号 JP20130004382 申请日期 2013.01.15
申请人 TOKYO ELECTRON LTD 发明人 MATSUMOTO AKIHIRO;MATSUSHITA MICHIAKI;SHINDO SATORU;KURATOMI KAZUNORI
分类号 H01L21/673;H01L21/027;H01L21/677 主分类号 H01L21/673
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