SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same, capable of preventing the reliability of the semiconductor device from being reduced even when a plurality of kinds of elements are mounted on the same substrate.SOLUTION: A method of manufacturing a semiconductor device includes the following steps of: mounting a first element 25 on a wiring substrate 21; placing a first heat radiation plate 32 on the first element 25 via a metal material 31; fixing the first heat radiation plate 32 to the first element 25 via the metal material 31 by heating and melting the metal material 31; and mounting a second element 36 on the wiring substrate 21 after fixing the first heat radiation plate 32 to the first element 25.