| 摘要 |
The present invention relates to a TO housing and a method for producing the same. The TO housing and a method for producing the same according to one embodiment of the present invention includes a socket which receives a device (5). According to the embodiment of the present invention, the TO housing is arranged in an air gap between a printed circuit board (12) and the socket. According to the embodiment of the present invention, the TO housing has a connection part which has a protrusion part. |
