发明名称 COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a highly reliable compound semiconductor device which can inhibit remaining of a generated hole in a device and improve switch characteristics to prevent device rupture.SOLUTION: A compound semiconductor device comprises: a compound semiconductor layer 2c; an insulation film 6 formed on the compound semiconductor layer 2c; and a gate electrode 9 and a field plate electrode 12 which are formed on the insulation film 6. The insulation film 6 has a part 6b which is located under the field plate electrode 12 and has a higher valence band level at a junction plane with the compound semiconductor layer 2c than a valence band level of the compound semiconductor layer 2c.</p>
申请公布号 JP2014138171(A) 申请公布日期 2014.07.28
申请号 JP20130007598 申请日期 2013.01.18
申请人 FUJITSU LTD 发明人 MOTOYOSHI KATSUSADA ; YOSHIKAWA SHUNEI
分类号 H01L29/812;H01L21/205;H01L21/336;H01L21/338;H01L29/06;H01L29/778;H01L29/78;H01L29/786;H02M3/28 主分类号 H01L29/812
代理机构 代理人
主权项
地址