发明名称 |
COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a highly reliable compound semiconductor device which can inhibit remaining of a generated hole in a device and improve switch characteristics to prevent device rupture.SOLUTION: A compound semiconductor device comprises: a compound semiconductor layer 2c; an insulation film 6 formed on the compound semiconductor layer 2c; and a gate electrode 9 and a field plate electrode 12 which are formed on the insulation film 6. The insulation film 6 has a part 6b which is located under the field plate electrode 12 and has a higher valence band level at a junction plane with the compound semiconductor layer 2c than a valence band level of the compound semiconductor layer 2c.</p> |
申请公布号 |
JP2014138171(A) |
申请公布日期 |
2014.07.28 |
申请号 |
JP20130007598 |
申请日期 |
2013.01.18 |
申请人 |
FUJITSU LTD |
发明人 |
MOTOYOSHI KATSUSADA ; YOSHIKAWA SHUNEI |
分类号 |
H01L29/812;H01L21/205;H01L21/336;H01L21/338;H01L29/06;H01L29/778;H01L29/78;H01L29/786;H02M3/28 |
主分类号 |
H01L29/812 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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